Mon Sep 23 21:49:24 UTC 2024: ## Broadcom Unveils Sian2 Chip for High-Speed AI Networks
**IRVINE, CA – September 23, 2024** – Broadcom Inc. today announced the launch of its new Sian2 chip, designed to power the high-speed optical networks essential for artificial intelligence (AI) clusters.
The Sian2 boasts double the bandwidth of its predecessor, the Sian, enabling it to transfer data at 200 gigabits per second per lane. This increased bandwidth translates to a significant reduction in the number of transceivers required for building fiber optic networks, lowering procurement costs and energy consumption.
The chip’s advanced features include a five-nanometer manufacturing process, a laser driver for efficient light generation, and support for Forward Error Correction (FEC) technology. FEC enhances network reliability by transmitting data multiple times, mitigating errors that can occur during transmission.
“200G/lane DSP is foundational to high-speed optical links for next generation scale-up and scale-out networks in the AI infrastructure,” said Vijay Janapaty, vice president and general manager of Broadcom’s physical layer products division.
The Sian2 is currently being sampled to early customers. Broadcom is confident that this new chip will play a crucial role in supporting the rapid growth of AI and its demanding data processing requirements.
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